Technology

Results: 1849-1860 of 31280

Blee Raises $27 Million to Introduce AI Content Governance to the Enterprise

Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing

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Quantinuum Finalizes $100 Million CHIPS R&D Award with U.S. Department of Commerce to Advance Trapped-Ion Quantum Computer Manufacturing in the US

ContentCon 2026: Every Brand Now Has Two Audiences, Humans and Agents

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Beyond Guesswork: Appier Research Teaches AI to Recognize Its Limits and Choose the Right Reasoning Approach

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Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

IC Optimize Announces Odin and Joins the Cadence Connections Program

HTEC, a global AI-first engineering and technology services company, and Modular have demonstrated Modular's AI software stack running on Google's TPU architecture. Presented at ModCon 2026, the work shows that support for a new silicon target can be delivered by extending an existing software foundation rather than rebuilding it for each accelerator.

HTEC and Modular Extend MAX and Mojo to Google TPU, Cutting AI Hardware Enablement from Years to Months

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Every Entrepreneur Needs Someone to Call: Lenovo and Eva Longoria Open a New Line of Support for Entrepreneurs with “Call Eva”

OMP Asia Conferences to Showcase How Industry Leaders Kraft Heinz, Mars, Medac, And Nestlé Approach AI-Powered Supply Chain Planning At "Decision Velocity"

57% of Brands Can't Prove ROI on Sports Fan Engagement Despite Rising Investment

ECOVACS Defines the Future of Robotic Floor Cleaning with Third-Generation OZMO ROLLER Technology